The next-generation printed electronics industry requires new tools to match new possibilities. CLIP aims to develop the inks needed for high-volume printed and flexible electronics.

Printed electronics presents a wide variety of possibilities. New means of manufacturing electronics with simple, cheap processing could radically alter the foundations of the semiconductor industry. Equally, new possibilities could be enabled when flexible and integrated electronic circuitry and components are enabled. Animated packaging, integrated solar cells and flexible rolls of OLED lighting are among the concepts being pursued as part of the printed electronics movement.

Such innovations rely on a working value chain of materials, components, printing tools and production lines.

PDIM (Pre-Deposited Images in Metal) deposits pure conductive metal. Fine traces in any pattern desired can form circuitry, networks, buss bars or grids. A conductive grid for example consisting of 25um traces criss crossed every 500um yield a TCF with 96% transparancy with the deposited metal surface resistance values of 1, .5 or even .1 Ohm/sq. A PDIM grid can be used as is for many applications but can also be used to produce "enhanced" conductive film products by overcoating it using ITO, PEDOT, Silver NanoWire or graphenes.

Project officer: Monika Kacik | Reference: 243557

The EU Commission has announced the initiation of the Conductive Low-cost Ink Project (CLIP), through its 7th Framework Programme. Bringing together SMEs and associations, CLIP aims to develop a set of low-cost inks to enable EU-based businesses to address the growing potential of printed electronics.